The Sd 845 is not even announced and the rumor mill has started on the successor chipset for it. Reliable leakster Roland Quandt has managed to unearth to some information on the Snapdragon 855 through the Linkedin profile of a Qualcomm software engineer titled George Fang.
Fang’s profile has uncovered that the Sd 845 that has a description of “a complex SoC of a latest mobile processor (SDM 845) owned by Qualcomm” carries a codename of Napali v2.0. Rumors have revealed that it is the second-generation 10nm chipset in Qualcomm.
It is interesting to know that Qualcomm might have presently started working on Snapdragon 855 chipset as Fang’s Linkedin profile describes it as “a newest cpu (SDM855 series) owned by Qualcomm” and it is codenamed as Hana v1.0. Gossips have it that it is 7nm chipset that will be powering flagship phones in 2019.
Speculations have it that TSMC will be manufacturing the 7nm Snapdragon 855, and not Samsung. A Chinese leakster has uncovered that it is low power consuming chipset and the phones that will be powering will feature ultrasonic fingerprint camera under the panel. The SoC is Furthermore speculated to Supply 30 to 40 percent improved performance than SD 845. It is Furthermore expected to carry AI capabilities.
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