Continuing the trend, the brand’s General Manager Lu Weibing Presently unfolded that the next Redmi K30 Pro will cram in up to 61 components per square centimeter in its chassis.
A couple of days back, Mr. Lu explained the difficulties involved in implementing pop-up digital camera design in 5G phones. He said that 5G components need more space and hence manufacturers have been avoiding pop-up cameras lately in 5G devices with Redmi K30 Pro being an exception. He In addition added that 5G phones require a bigger battery and much better thermal overall performance, what Sad to say cannot be achieved by dividing the motherboard into two sections – a common design in smartphones with pop-up cameras.
Thus, Redmi K30 Pro opted for a alternative prepare that compelled the brand to adopt the now-common sandwich (stacked) motherboard design present in flagship phones as its parent company’s Mi 10 Pro. As per Mr. Lu, the product will cram in up to 61 parts per square centimeter by stacking up one motherboard more than an additional. He also said that the phone will include 3885 parts, what is 268% much more than that of last year’s Redmi K20 Pro.
He Furthermore confirmed that the pop-up camera will pop in / out within 0.58 seconds, thanks to the new stepper motor with a speed of 14.2mm per second, up from 11.5mm per second of its predecessor. That means, it will be 27% faster than the last generation and hence will retract quicker than before during accidental falls.