Qualcomm sd 855 7nm soc released with support for 5g connectivity

Qualcomm Sd 855 7nm SoC released with support for 5G connectivity

Qualcomm sd 855 7nm soc released with support for 5g connectivity
As coming, during the Snapdragon Technology Summit 2018, US-based chipset manufacturer has announced its newest flagship mobile chipset — Qualcomm Snapdragon 855. The Snapdragon 855, what is the successor of the current-generation Snapdragon 845, arrives with support for 5G connectivity and a few other attributes, aimed at improving the user experience.

Qualcomm sd 855 7nm soc released with support for 5g connectivity

The smartphone industry is moving towards the 5G-era and Qualcomm being the dominant mobile chipset manufacturer, is leaving no stones unturned after it ships to 5G connectivity. The newly reported Qualcomm Snapdragon 855 is the world’s first commercial 5G mobile platform.

The chipset is offering 5G connectivity using the company’s own Snapdragon X50 5G modem. The 5G modem is mixed with Qualcomm QTM052 mmWave antenna modules with integrated RF trans-receiver, RF front-end antenna, and antenna elements.

The octa-core processor attributes four power-saving cores clocked at 1.78GHz, three performance cores clocked at 2.42GHz and another unique “gold” core for performance boost what is clocked at 2.84GHz. It is coupled with Adreno 640 graphics cpu, what is expected to bring experience improvement.

Just which includes the Apple A12 Bionic chipset and Huawei’s Kirin 980 processor, the Qualcomm Sd 855 is In addition manufactured using the 7nm process by TSMC. The Snapdragon 855 In addition arrives with the company’s fourth-generation, multi-core AI Engine that is claimed to suggests up to 3 times the AI overall performance compared to the Snapdragon 845.

The newly unveiled chipset moreover features the world’s initial Computer Vision Image Signal Cpu (CV-ISP) to deliver fresh photo and video capture features. For the gaming, the company revealed Sd Elite Gaming, a set of options in the mobile platform to enhance mobile gaming experiences.

The manufacturer has moreover noted the Qualcomm 3D Sonic Sensor—an under-display fingerprint scanner solution that uses ultrasonic waves, unlike optical under-display fingerprint sensors what use light. According to the manufacturer, 3D Sonic Sensor is additional secure and correct than the alternative.

Most of the high-end cameraphone expected in 2019 will be powered by Qualcomm Snapdragon 855 octa-core chipset. We’ll be seeing devices in manufacturers this kind of as Samsung, Xiaomi, LG, HTC, Motorola, Google, Sony, OnePlus, Oppo, and Vivo from early next year.

Qualcomm will reveal more details about the Sd 855 mobile platform as the Snapdragon Technology Summit 2018 continues in Hawaii, USA. Stay tuned for more updates throughout the Summit.


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