Chinese rugged smartphone company AGM has officially reported that it will hold a global smartphone release conference on August 29 in Shenzhen. The occasion which is scheduled to commence at 2 pm will herald the formal unveiling of the company’s latest rugged flagship model dubbed AGM X3.
The AGM X3 flagship has featured in handful of teasers and promotional articles. The most spectacular aspect When it comes the device is the Snapdragon 845 chipset it will pack. The model takes higher than the rein from exact models such as the AGM X1 and X2. Thus, it is the third-gen model.
Although the design and style is still to be fully revealed, the product need to have little change from the X2 and the seems to be will be that of a high quality but a rugged cameraphone with waterproof features. The entire specs of the product had moreover appeared online previously. From the leaked specifications, we know the AGM X3 will sport a 5.99-inch show with an 18:9 aspect ratio. AGM will suggests 2 variants of the smartphone: one equipped with 6 GB of RAM and 64 GB of memory, an additional outfitted with 8 GB of LPDDR4X and 128 GB of NAND flash.
On the camera close, the X3 will pack a dual rear camera featuring 24MP + 12MP sensors as well as a front sensor featuring a 20MP digital camera. As for security features, the phone will support a fingerprint reader and a facial recognition tech. Connectivity attributes on the smartphone will include things like the integrated X20 4G modem in the SoC, 2?2 802.11ac Wi-Fi, Bluetooth 5.0, NFC, and USB Type-C. The rugged flagship will Furthermore arrive with an IP68 waterproof and dustproof rating.