The Meizu Pro 6s that was unveiled less than two weeks ago, but it’s such a minor upgrade over the Pro 6 (if at all an upgrade) that it’s no wonder that a Pro 7 is not only in the works, but coming by the end of the year.
What are claimed to be leaked presentation slides for the smartphone’s announcement reveal a ton of key specs. Chief among those is the Kirin 960 chipset. It seems that gone are the days of Meizu’s partnership with Samsung that brought us the Exynos 7420-powered Pro 5. Instead, the Pro 7 is tipped to rely on Huawei’s latest SoC, which introduces the new Cortex-A73 CPU cores and the Mali-G71 Vulkan-enabled GPU.`The ‘more is better’ trend has been ruling in the RAM department for a while now and 6GB is the new 4GB – the Pro 7 is keeping up with the times, the slides suggest. Additionally, the Sony IMX 386 sensor should be tasked with handling image capture – the same 12MP one as in the Pro 6s.
More intriguingly, the Sonavation name slapped on a slide hints at an ultrasound under-glass fingerprint sensor. That, and the fact that such a solution is actually pictured on a slide itself.
You might want to hold off that Pro 6s purchases, by the way, as the Pro 7 is allegedly scheduled for a December 24 announcement.